29
2026-05
Samsung has shipped the industry’s first 12‑stack HBM4E memory samples , delivering 48GB per stack . The new generation ...
28
2026-05
On May 27, ChangXin Memory Technology passed its STAR Market IPO review . The company – China’s largest integrated DRAM ...
27
2026-05
On May 27, PCB and laminates leader Kingboard Laminate announced another price hike – the second this year. The company ...
27
2026-05
The NXP LPC8N04FHI24E: A Low-Power Arm Cortex-M0+ MCU for NFC-Enabled IoT Edge Devices The rapid expansion of the Intern...
26
2026-05
A new domestically developed chip‑scale MEMS active cooling fan is reportedly being tested for advanced Chinese processo...
26
2026-05
Samsung’s third‑largest union, Donghaeng – representing the Device Experience (DX) division (phones, TVs, home appliance...
25
2026-05
Unigroup Guoxin ( 002049.SZ ) announced a 263million(RMB1.9B)∗∗acquisitionof∗∗100263million(RMB1.9B)∗∗acquisitionof∗∗100...
20
2026-05
TSMC is accelerating its panel‑level packaging development, focusing on the 310×310mm mainstream size and conducting gla...
19
2026-05
The US Federal Trade Commission (FTC) has opened an antitrust investigation into Arm, demanding the company preserve all...
18
2026-05
The semiconductor price hike wave has spread to Power Management ICs (PMICs) , driven by rising wafer foundry and packag...
15
2026-05
NXP LPC3250FET296/01: A Comprehensive Technical Overview of the ARM9-Based Microcontroller The NXP LPC3250FET296/01 is a...
15
2026-05
SMIC reported record Q1 2026 revenue of $2.505 billion , up 11.5% YoY. Gross margin rose to 20.1% , up 0.9 percentage po...
